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Browse the departmentHome » Products » Photonics & R&D » Cameras & Imaging » Advanced Imaging » Adapters, Lenses & Systems » ToupTek BSM – Modular SWIR Microscope (900-1700 nm) for Silicon See-Through Imaging
ToupTek BSM is a modular microscope operating in the short-wave infrared (900-1700 nm), extending classical optical microscopy beyond visible light. It combines sensitive SWIR cameras, dedicated optics, and modular illumination and mechanics – for non-destructive inspection in semiconductor manufacturing, materials science, and industry.
SWIR photon energy is lower than silicon’s bandgap, so the 900-1700 nm band penetrates silicon – allowing you to look beneath the surface of wafers, chips, and interconnects, revealing hidden cracks and defects. BSM does this using standard glass optics (cheaper and simpler than MWIR/LWIR reflective optics), integrating with conventional microscope platforms.
| Band | 900-1700 nm (SWIR) |
| Capability | silicon penetration (subsurface defects) |
| Objectives | M Plan Apo NIR 5x-50x HR (down to 0.4 µm) |
| Illumination | coaxial Kohler, LED 1200-1550 nm |
| Cameras | SWIR 0.33-5 MP, TEC, C-mount |
| Mechanics | CNC, anti-vibration, modular |
| Tube configurations | T100VA / T180VB / T090VA / T110VA |
We select ToupTek systems, objectives and adapters to match your microscope/camera and application. Contact Interlab for a quote and configuration guidance.
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Product: ToupTek BSM – Modular SWIR Microscope (900-1700 nm) for Silicon See-Through Imaging